Huawei Technologies is set to unveil a significant step towards reducing China’s dependence on high-bandwidth memory (HBM) chips – crucial components for artificial intelligence applications. The announcement is expected during the 2025 Financial AI Reasoning Application Landing and Development Forum in Shanghai, which is being organised in collaboration with China UnionPay. If you’ve ever followed tech trends, you’ll appreciate how vital such moves are in shaping the future of AI.
This development could mark another clear stride for Huawei as it works to build a self-reliant AI hardware ecosystem in the face of persistent US sanctions. Right now, key suppliers include US firms like Micron Technology and Advanced Micro Devices, alongside South Korean leaders Samsung Electronics and SK Hynix.
Even with progress made, China’s main memory chip producers – Yangtze Memory Technologies and Changxin Memory Technologies – still lag behind their American and South Korean counterparts in both production capacity and technological prowess.
