China’s leading flash memory manufacturer, Yangtze Memory Technologies Co (YMTC), is making waves with its latest announcement. They’ve introduced nearly 20 new patents designed to boost computing efficiency and optimize chip-stacking structures. This is a big step forward in their technology journey, as noted by the country’s intellectual property agency.
YMTC is well-known for its work in 3D NAND technology. This type of flash memory stacks transistor dies vertically to pack more storage into a smaller space. The recent patent applications reveal some exciting advancements. These include a new stacking structure that’s tough against deformation, ways to protect against electromagnetic interference, and methods to increase storage density. All of this comes from records at the China National Intellectual Property Administration.
Some of these patents are focused on software improvements. One patent, intriguingly titled “a memory system and a method of operating the memory system,” introduces a fresh approach for data refreshing in flash memory. The goal? To cut down on how often the memory device needs to be erased, delay wear-out failures, and ultimately extend the memory system’s life.
These patents, filed between 2021 and 2023, were officially published on March 28. According to You Yunting, a senior partner at Shanghai Debund Law Firm, the patent approval process usually takes about a year. However, more complex cases can stretch this timeline to four or five years.
Revealing these patents is a significant milestone for YMTC and China as a whole, especially as the country strives for greater semiconductor self-sufficiency amidst ongoing US technological restrictions. In related news, Huawei Technologies has also recently shared a patent application in ternary logic for integrated circuits. Meanwhile, SiCarrier, a Huawei-backed chip tool manufacturer, showcased new products at the latest Semicon China exhibition.
